Investigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converter

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dc.authorid0000-0003-2234-3453en_US
dc.contributor.authorLi, Songgang
dc.contributor.authorSubramaniam, Umashankar
dc.contributor.authorYang, Guobiao
dc.contributor.authorGhaderi, Davood
dc.contributor.authorRajabiyoun, Niloufar
dc.date.accessioned2021-03-20T20:12:22Z
dc.date.available2021-03-20T20:12:22Z
dc.date.issued2020
dc.departmentBTÜ, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik Elektronik Mühendisliği Bölümüen_US
dc.description.abstractThis study presents the effects of the vibration and thermal cycling on the fatigue life of a power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) in a power converter circuit. The fatigue mechanism in per loading mode was investigated separately and based on the overlap approach, the synchronous effects were analyzed. The solder creeps & x2019; attitudes are depended on the fatigue life for the thermal loops. The success of the deposited strain per thermal loop is in direct relation with the fatigue lifetime. The main source of the stress in the packaging process is the differences between the components & x2019; thermal coefficients. To evaluate the effects of the vibration on the fatigue life for the solder layers, the RMS value of the peeling stress was considered. According to the results, the maximum stress and main affected points realized at the corners of the layers. It has been identified that the assembling of the thermal effects and mechanical loads are quickened the failure rate at the solder joints for this device. The Finite Element Method (FEM) is used for the simulation and the results confirm the estimated crack formation places in the layers.en_US
dc.identifier.doi10.1109/ACCESS.2020.2985320en_US
dc.identifier.endpage64019en_US
dc.identifier.issn2169-3536
dc.identifier.scopusqualityQ1en_US
dc.identifier.startpage64011en_US
dc.identifier.urihttp://doi.org/10.1109/ACCESS.2020.2985320
dc.identifier.urihttps://hdl.handle.net/20.500.12885/517
dc.identifier.volume8en_US
dc.identifier.wosWOS:000530832200116en_US
dc.identifier.wosqualityQ2en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.institutionauthorGhaderi, Davood
dc.language.isoenen_US
dc.publisherIeee-Inst Electrical Electronics Engineers Incen_US
dc.relation.ispartofIeee Accessen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectVibrationsen_US
dc.subjectFatigueen_US
dc.subjectSolderingen_US
dc.subjectFinite element analysisen_US
dc.subjectStressen_US
dc.subjectThermal analysisen_US
dc.subjectMOSFETen_US
dc.subjectSolder jointsen_US
dc.subjectpower MOSFETen_US
dc.subjectfatigue lifeen_US
dc.subjectfinite element method (FEM)en_US
dc.titleInvestigation of the Thermal Loading and Random Vibration Influences on Fatigue Life of the Solder Joints for a Metal-Oxide-Semiconductor-Field-Effect Transistor in a DC-DC Power Boost Converteren_US
dc.typeArticleen_US

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