Influence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Module

Basit Öğe Kaydı
dc.authorid0000-0003-2234-3453en_US
dc.contributor.authorSamavatian, Vahid
dc.contributor.authorMasoumian, Armin
dc.contributor.authorMafi, Mehdi
dc.contributor.authorLakzaei, Mostafa
dc.contributor.authorGhaderi, Davood
dc.date.accessioned2021-03-20T20:12:43Z
dc.date.available2021-03-20T20:12:43Z
dc.date.issued2019
dc.departmentBTÜ, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik Elektronik Mühendisliği Bölümüen_US
dc.description.abstractIn this paper, fatigue life of solder joints of the power module and the printed circuit board in a power inverter under directional random vibration using the finite element method (FEM) was evaluated. Five angles of 0 degrees, 30 degrees, 45 degrees, 60 degrees, and 90 degrees were selected for direction of vibration loading. The simulation results showed that the outermost corner of the solder layer undergoes the maximum stress during the vibration frequencies in all the situations. In general, with the increase of input frequency, the solder joints got more susceptible to the catastrophic failure. Moreover, it was found that in lower angles of loading direction, the peeling stress is dramatically increased in the solder layer. This event can be attributed to the considerable portion of shear stress in loading directions with lower angles. The experimental results also proved the FEM simulation and showed that the void growth and coalescence, resulted by fatigue, are intensified in the lower angles of vibration loading. Overall, this paper indicates that the reliability of a power module under a normal loading (90 degrees) is the highest among all other conditions.en_US
dc.identifier.doi10.1109/TCPMT.2018.2838148en_US
dc.identifier.endpage268en_US
dc.identifier.issn2156-3950
dc.identifier.issn2156-3985
dc.identifier.issue2en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.startpage262en_US
dc.identifier.urihttp://doi.org/10.1109/TCPMT.2018.2838148
dc.identifier.urihttps://hdl.handle.net/20.500.12885/676
dc.identifier.volume9en_US
dc.identifier.wosWOS:000457629400008en_US
dc.identifier.wosqualityQ3en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.institutionauthorGhaderi, Davood
dc.language.isoenen_US
dc.publisherIeee-Inst Electrical Electronics Engineers Incen_US
dc.relation.ispartofIeee Transactions On Components Packaging And Manufacturing Technologyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectFatigue lifeen_US
dc.subjectshear stressen_US
dc.subjectsolderen_US
dc.subjectvibrationen_US
dc.titleInfluence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Moduleen_US
dc.typeArticleen_US

Dosyalar

Koleksiyon

WoS İndeksli Yayınlar Koleksiyonu
Elektrik Elektronik Mühendisliği Bölümü Yayın Koleksiyonu
Scopus İndeksli Yayınlar Koleksiyonu