Granular PCM based heat sink for electronics thermal management

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dc.contributor.authorShajahan, Mohamed Iqbal
dc.contributor.authorBenim, Ali Cemal
dc.date.accessioned2026-02-08T15:15:07Z
dc.date.available2026-02-08T15:15:07Z
dc.date.issued2026
dc.departmentBursa Teknik Üniversitesi
dc.description.abstractThis study investigates aluminum heat sinks integrated with GR42 phase change material (PCM), aiming to enhance thermal inertia and stabilize device temperatures. This is important, since the increasing miniaturization and performance demands for electronic devices have led in a growing need for advanced thermal management systems capable of handling rapid transient loads. The novelty of the work lies in examining different heat sink layouts that optimize the heat dissipation capabilities of GR42 PCMs while minimizing size and weight for electronic cooling. The experimental testing was conducted using three configurations, namely no fin, circular fin and hexagonal fin, with three input powers (4 W, 8 W, and 12 W). The experimental results show that the hexagonal-fin heat sink, surface area is 25 % more than circular fins, exhibited superior thermal performance without significant variation in input power. Notably, the hexagonal-fin heat sink achieved the desired set point temperature of 55 degrees C in 33 % less time than the circular-fin design and 45 % less time than the heat sink without fins. Furthermore, the peak temperatures increased up to 21 % for circular fins. During the charging cycles, the enhancement ratios vary from 72 % and begin to narrow to 25 % during discharge cycles. The hexagonal-fin configuration also exhibited superior melting dynamics, completing the phase transition 44 % faster at higher input power than the circular fins, and established a thermal deviation of nearly 51 % less than finless heat sinks. These findings underscore the critical role of fin geometry and PCM integration in achieving uniform temperature distribution and improved energy storage efficiency. Overall, the hexagonal-fin heat sink with GR42 PCM shows strong potential as a passive cooling solution for low-power portable electronic devices.
dc.description.sponsorshipScience and Engineering Research Board-SERB, New Delhi, India [TAR/2022/000252]; Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) [532148125]; Central publication fund of Hochschule Dusseldorf University of Applied Sciences; Deutsche Forschungsgemeinschaft (DFG, German Research Foundation); Central publication fund of Hochschule Duesseldorf University of Applied Sciences
dc.description.sponsorshipThe authors extend their appreciation towards the partial funding of this investigation under the scheme of Teachers Association for Research Excellence (TARE)-File number: TAR/2022/000252 by the funding agency Science and Engineering Research Board-SERB, New Delhi, India. The publication of this article is funded by the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation)-532148125 and supported by the central publication fund of Hochschule Duesseldorf University of Applied Sciences.
dc.identifier.doi10.1016/j.applthermaleng.2025.129336
dc.identifier.issn1359-4311
dc.identifier.issn1873-5606
dc.identifier.scopus2-s2.0-105024240066
dc.identifier.scopusqualityQ1
dc.identifier.urihttps://doi.org/10.1016/j.applthermaleng.2025.129336
dc.identifier.urihttps://hdl.handle.net/20.500.12885/5616
dc.identifier.volume286
dc.identifier.wosWOS:001639146600001
dc.identifier.wosqualityQ1
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherPergamon-Elsevier Science Ltd
dc.relation.ispartofApplied Thermal Engineering
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/openAccess
dc.snmzWOS_KA_20260207
dc.subjectHeat sinks
dc.subjectPortable electronic cooling
dc.subjectLatent heat storage
dc.subjectGR42 PCM
dc.subjectHexagonal fin
dc.subjectCircular fin
dc.titleGranular PCM based heat sink for electronics thermal management
dc.typeArticle

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