Analysis of Multilayered Power Module Packaging Behavior Under Random Vibrations

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dc.authorid0000-0003-2234-3453en_US
dc.contributor.authorLiang, Di
dc.contributor.authorWu, Qiong
dc.contributor.authorGhaderi, Davood
dc.contributor.authorGuerrero, Josep M.
dc.date.accessioned2021-03-20T20:09:19Z
dc.date.available2021-03-20T20:09:19Z
dc.date.issued2020
dc.departmentBTÜ, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik Elektronik Mühendisliği Bölümüen_US
dc.description.abstractSolder joints are the critical components of the printed circuit boards (PCBs) in the moving electronic systems, such as satellites and automotive industries that are most vulnerable to accidental vibrations. Therefore, the reliability of these boards since they are designed to be used for long-time applications is important. Since the laboratory tests are time-consuming and require well-equipped and costly measurement devices, reliability tests are preferred to perform through the analytical methods. In this article, an analytical model based on the multilayer plate theory is presented for the random vibration analysis, and the results are obtained for the different vibration frequencies, including the natural vibration frequency. For the proposed model, the state of the PCB layer and the amount of the stress in the solder joints are investigated separately, and the normal and shear stresses are obtained through the combined sinusoidal-exponential equation. Results by the finite-element method (FEM) analysis show that the cracks form at the edge of the interconnection points of the board, and the solder and void formation and crack propagation appear in the corners of the PCB in frequencies closed to the natural vibration frequency. Reliability increases by the reduced solder height.en_US
dc.description.sponsorshipVILLUM FONDEN [Center for Research on Microgrids (CROM)] under the VILLUM Investigator Grant [25920]en_US
dc.description.sponsorshipThis work was supported by VILLUM FONDEN [Center for Research on Microgrids (CROM)] under the VILLUM Investigator Grant 25920.en_US
dc.identifier.doi10.1109/TCPMT.2020.2995735en_US
dc.identifier.endpage1707en_US
dc.identifier.issn2156-3950
dc.identifier.issn2156-3985
dc.identifier.issue10en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.startpage1700en_US
dc.identifier.urihttp://doi.org/10.1109/TCPMT.2020.2995735
dc.identifier.urihttps://hdl.handle.net/20.500.12885/362
dc.identifier.volume10en_US
dc.identifier.wosWOS:000576421400014en_US
dc.identifier.wosqualityQ3en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.institutionauthorGhaderi, Davood
dc.language.isoenen_US
dc.publisherIeee-Inst Electrical Electronics Engineers Incen_US
dc.relation.ispartofIeee Transactions On Components Packaging And Manufacturing Technologyen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectVibrationsen_US
dc.subjectMathematical modelen_US
dc.subjectStressen_US
dc.subjectLoadingen_US
dc.subjectStrainen_US
dc.subjectLoad modelingen_US
dc.subjectSolderingen_US
dc.subjectFatigue lifeen_US
dc.subjectsolderen_US
dc.subjectvibrationen_US
dc.titleAnalysis of Multilayered Power Module Packaging Behavior Under Random Vibrationsen_US
dc.typeArticleen_US

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