Building Parameter Analysis with S-UTD-CH model in Multiple Diffraction

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dc.contributor.authorTabakcıoğlu, Mehmet Barış
dc.contributor.authorAyberkin, Doruk
dc.date.accessioned2021-03-20T20:15:16Z
dc.date.available2021-03-20T20:15:16Z
dc.date.issued2015
dc.departmentBTÜ, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik Elektronik Mühendisliği Bölümüen_US
dc.description23nd Signal Processing and Communications Applications Conference (SIU) -- MAY 16-19, 2015 -- Inonu Univ, Malatya, TURKEYen_US
dc.descriptionAyberkin, Doruk/0000-0003-3409-8926en_US
dc.description.abstractElectromagnetic wave propagation models are used in radio planning tool and coverage prediction. These models are based on ray tracing technique or numerical. Slope UTD with convex hull model is a model which has less computation time, higher accuracy of prediction and based on ray tracing technique. S-UTD-CH model is used in multiple diffraction due to that this model gives more accurate results in less computation time. Obstacles can be modelled as knife edge, wedge or cylinder in ultra-high frequencies. inner angle, structure type and relative permittivity constant and conductivity of obstacle and polarization type of electromagnetic wave change the relative path loss at the receiver. In the study, how building parameter changes the relative path loss is discussed.en_US
dc.description.sponsorshipDept Comp Engn & Elect & Elect Engn, Elect & Elect Engn, Bilkent Univen_US
dc.identifier.endpage115en_US
dc.identifier.isbn978-1-4673-7386-9
dc.identifier.issn2165-0608
dc.identifier.scopusqualityN/Aen_US
dc.identifier.startpage113en_US
dc.identifier.urihttps://hdl.handle.net/20.500.12885/1172
dc.identifier.urihttp://doi.org/10.1109/SIU.2015.7130223
dc.identifier.wosWOS:000380500900007en_US
dc.identifier.wosqualityN/Aen_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.institutionauthorTabakcıoğlu, Mehmet Barış
dc.language.isotren_US
dc.publisherIeeeen_US
dc.relation.ispartof2015 23Rd Signal Processing And Communications Applications Conference (Siu)en_US
dc.relation.ispartofseriesSignal Processing and Communications Applications Conference
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectWave diffractionen_US
dc.subjectS-UTD-CH modelen_US
dc.subjectray tracing techniqueen_US
dc.subjectimpedance wedgeen_US
dc.titleBuilding Parameter Analysis with S-UTD-CH model in Multiple Diffractionen_US
dc.typeConference Objecten_US

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