Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

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dc.authorid0000-0003-2234-3453en_US
dc.contributor.authorGhaderi, Davood
dc.contributor.authorPourmahdavi, Maryam
dc.contributor.authorSamavatian, Vahid
dc.contributor.authorMir, Omid
dc.contributor.authorSamavatian, Majid
dc.date.accessioned2021-03-20T20:12:31Z
dc.date.available2021-03-20T20:12:31Z
dc.date.issued2019
dc.departmentBTÜ, Mühendislik ve Doğa Bilimleri Fakültesi, Elektrik Elektronik Mühendisliği Bölümüen_US
dc.description.abstractIn this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading mode was individually analyzed, and then according to the incremental damage superposition approach, the simultaneous effects were thoroughly studied. Under thermal cycling, the creep behavior of the solder is linked to the fatigue life. In fact, the creep accumulated strain in each thermal cycle has a straight relation to the failure time of solder joint. The origin of stress/strain in the assembly is owing to the sharp difference between coefficients of thermal expansions of the components in the electronic package. Regarding the vibration loading, the root mean square of peeling stress as a widely acceptable failure indicator was used to evaluate the vibration effects on the fatigue life. It is determined that the maximum stress is concentrated at the corner of solder layer. This result was similar to the outcomes of thermal cycling. The results also indicated that the combination of thermal and mechanical loadings accelerates the failure of the solder joint of the power MOSFET. Furthermore, the experimental and simulation studies showed similar results and approved the crack initiation at the corner of solder layer.en_US
dc.identifier.doi10.1177/1464420718780525en_US
dc.identifier.endpage1763en_US
dc.identifier.issn1464-4207
dc.identifier.issn2041-3076
dc.identifier.issue9en_US
dc.identifier.scopusqualityQ2en_US
dc.identifier.startpage1753en_US
dc.identifier.urihttp://doi.org/10.1177/1464420718780525
dc.identifier.urihttps://hdl.handle.net/20.500.12885/599
dc.identifier.volume233en_US
dc.identifier.wosWOS:000479266000004en_US
dc.identifier.wosqualityQ3en_US
dc.indekslendigikaynakWeb of Scienceen_US
dc.indekslendigikaynakScopusen_US
dc.institutionauthorGhaderi, Davood
dc.language.isoenen_US
dc.publisherSage Publications Ltden_US
dc.relation.ispartofProceedings Of The Institution Of Mechanical Engineers Part L-Journal Of Materials-Design And Applicationsen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectSolderen_US
dc.subjectfinite element methoden_US
dc.subjectfatigueen_US
dc.subjectvibrationen_US
dc.subjectthermal cyclingen_US
dc.titleCombination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power moduleen_US
dc.typeArticleen_US

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