Utilization of different size waste melamine impregnated paper as an adhesive in the manufacturing of particleboard

Abstract

In this study, the efficiency of waste melamine impregnated paper (WMIP) as an adhesive; effects of WMIP usage with different sizes and amounts as a resin in three-layer particleboard manufacturing on mechanical, physical, surface roughness properties and formaldehyde emission values were investigated. Three-layer particleboards were manufactured with three different sizes (small, medium and large) and four different rates (10, 15, 20, 25% of total board weight) of WMIP. Mechanical (bending strength, modulus of elasticity, internal bond strength, surface soundness, screw withdrawal strength), physical (density, thickness swelling, water absorption, Brinell hardness, and surface roughness) properties and formaldehyde contents of the samples were determined ac-cording to relevant standards. As a result of the study, it was determined that WMIP still has some uncured adhesive with curing ability in it. The size and amount of WMIP had a statistically significant effect on the particleboard properties (Mechanical, Physical Formaldehyde emission and surface roughness). While the me-chanical and physical properties improved as the amount of WMIP increased, these values deteriorated as the size of the WMIP increased. The best mechanical and physical results were obtained by using small-size WMIP at the rate of 25% and all the panel groups produced with small-size WMIP (except 10% ratio) have achieved the mechanical values required in the standard. In all particleboard groups produced, only the one with 25% of the small-size WMIP used group was provided with the standard requirements for thickness swelling properties. For optimal performance (the least rough surface characteristics), the formulation of the panels should contain small WMIP sizes and a 20% WMIP ratio. The findings also showed that increasing the WMIP ratio has resulted in better mechanical properties. Through this study, some technological properties of three-layer particleboard produced with WMIPs were determined and potential utilization of WMIPs in particleboard manufacturing as an adhesive was demonstrated.