Cooling of Heated Blocks with Triangular Guide Protrusions Simulating Printed Circuit Boards

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Date

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Volume Title

Publisher

Mdpi

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info:eu-repo/semantics/openAccess

DOI

10.3390/su142315856

Abstract

Description

Journal or Series

Sustainability

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Scopus Q Value

Volume

14

Issue

23

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info:eu-repo/semantics/openAccess