Yazar "Yuce, Ozcan" seçeneğine göre listele

Listeleniyor 1 - 2 / 2
  • Küçük Resim Yok
    Öğe
    Effects of alkyl-ketene dimer on physical, mechanical and formaldehyde emission properties of particleboard produced with melamine-impregnated paper waste
    (Taylor & Francis Ltd, 2024) Basboga, Ibrahim Halil; Basboga, Hulya Varlibas; Tasdemir, Cagatay; Atar, Ilkay; Yuce, Ozcan; Karademir, Arif; Mengeloglu, Fatih
    This study aimed to enhance the physical properties and the weak heat transmission of the core layer, which are the weak points of particleboard produced using melamine-impregnated paper waste (MIPW) as an adhesive. Alkyl-ketene dimer (AKD) and paraffin were used as water-repellent chemicals. MIPW was used as an adhesive, and no additional resin was used. As a result of this study, the samples' physical properties improved with AKD and paraffin's existence. Moreover, it has been approved that AKD is more effective than paraffin in improving the physical properties of the particleboard because AKD improves ester bonding with hydroxyl groups of cellulose fibers. The usage of water repellents resulted in the improvement of internal bond (IB) properties. It was determined that the type and amount of water-repellent chemicals significantly affected the mechanical and physical properties and formaldehyde content of the produced particleboards, except for bending properties. Just the chemical type was found to be significantly effective on bending strength (BS) and modulus of elasticity (MOE) properties. Overall, the study findings suggested that AKD might be successfully utilized as a water-repellent chemical in particleboard manufacturing, while MIPWs used as an adhesive.
  • Küçük Resim Yok
    Öğe
    Utilization of different size waste melamine impregnated paper as an adhesive in the manufacturing of particleboard
    (Elsevier Sci Ltd, 2023) Basboga, Ibrahim Halil; Tasdemir, Cagatay; Yuce, Ozcan; Mengeloglu, Fatih
    In this study, the efficiency of waste melamine impregnated paper (WMIP) as an adhesive; effects of WMIP usage with different sizes and amounts as a resin in three-layer particleboard manufacturing on mechanical, physical, surface roughness properties and formaldehyde emission values were investigated. Three-layer particleboards were manufactured with three different sizes (small, medium and large) and four different rates (10, 15, 20, 25% of total board weight) of WMIP. Mechanical (bending strength, modulus of elasticity, internal bond strength, surface soundness, screw withdrawal strength), physical (density, thickness swelling, water absorption, Brinell hardness, and surface roughness) properties and formaldehyde contents of the samples were determined ac-cording to relevant standards. As a result of the study, it was determined that WMIP still has some uncured adhesive with curing ability in it. The size and amount of WMIP had a statistically significant effect on the particleboard properties (Mechanical, Physical Formaldehyde emission and surface roughness). While the me-chanical and physical properties improved as the amount of WMIP increased, these values deteriorated as the size of the WMIP increased. The best mechanical and physical results were obtained by using small-size WMIP at the rate of 25% and all the panel groups produced with small-size WMIP (except 10% ratio) have achieved the mechanical values required in the standard. In all particleboard groups produced, only the one with 25% of the small-size WMIP used group was provided with the standard requirements for thickness swelling properties. For optimal performance (the least rough surface characteristics), the formulation of the panels should contain small WMIP sizes and a 20% WMIP ratio. The findings also showed that increasing the WMIP ratio has resulted in better mechanical properties. Through this study, some technological properties of three-layer particleboard produced with WMIPs were determined and potential utilization of WMIPs in particleboard manufacturing as an adhesive was demonstrated.