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Öğe Computational thermal analysis of cylindrical fin design parameters and a new methodology for defining fin structure in LED automobile headlamp cooling applications(Pergamon-Elsevier Science Ltd, 2016) Sökmen, Kemal Fürkan; Yuruklu, Emrah; Yamankaradeniz, NurettinIn this study, the effects of fin design, fin material, and free and forced convection on junction temperature in automotive headlamp cooling applications of LED lights are researched by using ANSYS CFX 14 software. Furthermore a new methodology is presented for defining the optimum cylindrical fin structure within the given limits. For measuring the performance of methodology, analyses are carried out for various ambient temperatures (25 degrees C, 50 degrees C and 80 degrees C) and different LED power dissipations (0.5 W, 0.75 W, 1 W and 1.25 W). Then, analyses are repeated at different heat transfer coefficients and different fin materials in order to calculate LED junction temperature in order to see if the fin structure proposed by the methodology is appropriate for staying below the given safety temperature limit. As a result, the suggested method has always proposed proper fin structures with optimum characteristics for given LED designs. As another result, for safe junction temperature ranges, it is seen that for all LED power dissipations, adding aluminum or copper plate behind the printed circuit board at low ambient temperatures is sufficient. Also, as the ambient temperature increases, especially in high powered LED lights, addition of aluminum is not sufficient and fin usage becomes essential. High heat transfer coefficient and using copper fin affect the junction temperature positively. (C) 2015 Elsevier Ltd. All rights reserved.Öğe Thermal management and fin characteristic optimization of an electronic power supply utilizing Taguchi and ANOVA methods(Pergamon-Elsevier Science Ltd, 2024) Bademlioglu, Ali Husnu; Karatas, Osman Bedrettin; Sokmen, Kemal Furkan; Yuruklu, EmrahIn the rapidly advancing field of electronic power supplies, managing thermal performance is critical. This study focuses on optimizing fin geometries to enhance the thermal management of an amplifier used in car multimedia systems, utilizing Taguchi and ANOVA methods for both thermal and volumetric efficiencies. Analyses were conducted on the impact of five distinct fin parameters-fin gap, fin thickness, separated plate thickness, fin base thickness, and fin height-on the system's thermal behavior and the fin volume. Computational Fluid Dynamics (CFD) analyses were performed for 24 different configurations. These analyses showed significant potential for improvement in the original design, with optimizations leading to an 8.31% reduction in the amplifier temperature and a 51.91% reduction in the fin volume. The study identifies fin height as the most effective parameter on the amplifier temperature, with an effect rate of 57.26%, while fin base thickness showed the most significant effect on the fin volume, with an effect rate of 66.98%. These findings not only provide a basis for more efficient design but also offer predictive insights through formulated regression equations, thus reducing the dependency on extensive experimental setups.












