Now showing items 1-3 of 3
Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module
(Sage Publications Ltd, 2019)
In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue ...
Analysis of Multilayered Power Module Packaging Behavior Under Random Vibrations
(Ieee-Inst Electrical Electronics Engineers Inc, 2020)
Solder joints are the critical components of the printed circuit boards (PCBs) in the moving electronic systems, such as satellites and automotive industries that are most vulnerable to accidental vibrations. Therefore, ...
Influence of Directional Random Vibration on the Fatigue Life of Solder Joints in a Power Module
(Ieee-Inst Electrical Electronics Engineers Inc, 2019)
In this paper, fatigue life of solder joints of the power module and the printed circuit board in a power inverter under directional random vibration using the finite element method (FEM) was evaluated. Five angles of 0 ...